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novel techniques and materials for fiber optic chemical sensing
continuous methods for optically sensing chemical species rely on monitoring the optical properties of the analyte, preferentially via an optical waveguide, or by immobilizing some sort of indicator chemistry on a solid support or at the end of an optical fiber. the resulting devices are called optodes or optrodes. because the reagent is ..
effect of fiber treatment on the mechanical properties of hybrid fiber reinforced polystyrene composites. ii. use of glass fiber and wood pulp as hybrid fiber
the mechanical properties of polystyrene reinforced with a mixture of hardwood aspen chemithermomechanical pulp (ctmp) and surface-treated glass fiber have been studied. the adhesion of cellulose fiber to glass fiber as well as to thermoplastics improved thanks to various surface treatments of ctmp, e.g. coating with polymer+isocyanate or..
mass production back-grinding/wafer-thinning technology for gaas devices
a mass-production back-grinding technology that is applicable to a fully automatic wafer-thinning process in gaas device manufacturing is described. excellent productivity has been realized because the brittleness of gaas has been overcome. a mirrorlike, stress-free surface was obtained by utilizing the wafer-rotating downfeed grinding me..
the molecular beam epitaxial growth of gaas/si(100)' aspects of substrate preparation
si(100) substrates were prepared for the heteroepitaxial growth of gaas using four simple cleaning procedures. the effects of these different techniques upon the quality of gaas/si material have been assessed in situ by reflection high-energy electron diffraction (rheed): and ex situ employing double-crystal x-ray diffraction (xrd), hall ..
high-performance ion-implanted mes-fet on inp using enhanced barrier self-aligned schottky gate
summary form only given. an enhanced barrier schottky diode with a barrier height of 0.78 ev and an ideality factor of 1.04 was fabricated by chemically modifying the surface of inp without the aid of a dielectric layer. this process involves the solution treatment of the inp surface. the presence of ruthenium on the surface was determine..
high-aspect-ratio resist pattern fabrication by alkaline surface treatment
a new and simple high-aspect-ratio, single-layer resist process for the manufacture of very large scale integration (vlsi) devices is described. before the exposure step in the conventional process, an alkaline surface treatment is added to the positive photoresist. this treatment inhibits the dissolution of the unexposed resist layer dur..
micropatterning of surfaces by excimer laser projection
in the coming years, excimer lasers will play two important roles in microelectronic fabrication' as new light sources for submicron photolithography, and for direct surface patterning by ablation or etching. using this latter application, results are presented for 248 nm excimer laser formation of micron-sized patterns in several materia..
'just in time' cleaning improves the yields in fine line circuit manufacture
the author identifies the major parameters which affect the chances of contamination occurring, and then to evaluate conventional cleaning techniques with respect to these factors. he next describes a new approach to contamination control which minimises the risk of contamination in a cost-effective manner. in conclusion, some aspects of ..
characterization of 30 nm nitrided oxides fabricated by rapid thermal nitridation
the electrical characteristics of 30 nm nitrided oxide layers fabricated by rapid thermal nitridation of sio/sub 2/ were investigated. the fixed positive charge, the interface state density, the interface state generation during stressing and electron trapping are increased upon nitridation. the negative bias instability and the total hol..
plasma-enhanced cvd of high quality insulating films
a modified plasma-enhanced chemical vapor deposition process (he-pecvd) is described, and used to deposit high quality silicon-based insulators at low substrate temperatures (