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plasma-deposited amorphous carbon films as planarization layers
a dry planarization process has been developed that utilizes plasma-enhanced chemical vapor deposition of amorphous carbon films the characteristics of the films depend on deposition conditions such as source gas composition, rf power, degree of ion bombardment, temperature, pressure, and electrode spacing. planar films were deposited at ..
effect of fiber treatment on the mechanical properties of hybrid fiber reinforced polystyrene composites. iii. use of mica and sawdust as hybrid fiber
an attempt was made to discover the hybridization effect of surface-treated mica and wood flour on the mechanical properties of polystyrene composites. both soft-wood (spruce) and hardwood (aspen) species were used. the effect of various treatments of wood flour (e.g., coating with polystyrene+isocyanate or with a silane coupling agent as..
improved junction properties of au-n-gasb schottky diodes after chemical modification of gasb surfaces
polycrystalline n-gasb grown by the vertical bridgman method was chemically treated with ru/sup 3+/ ions. electrical characterisation showed improvement in the electron mobility from 1162 to 1442 cm/sup 2//v s, while the carrier concentration remained almost constant (1*10/sup 17/ cm/sup -3/). schottky diodes were fabricated by thermal de..
molecular electronic technology for biosensors
summary form only given. a molecular-electronic biosensor device has been assembled by depositing a monolayer of glucose oxidase on a platinum electrode surface and by electrochemical polymerization of pyrrole to form a molecular film of polypyrrole in between the deposited glucose oxidase molecules. the polypyrrole has been found to work..
sensors on surfaces
immobilization of the enzyme acetylcholinesterase on a glass substrate has been demonstrated. the substrate was prepared with a thiol-terminal silane, to which was bonded the heterobifunctional cross-linker, n-gamma-maleimidobutyryloxy succinimide ester. the terminal amino groups of the enzyme were then attached to the cross-linker, yield..
sputter-etching and plasma effects on the electrical properties of titanium nitride contacts on n-type silicon
titanium nitride schottky barrier diodes were fabricated on n-type silicon and their current-voltage characteristics studied as a function of substrate treatment prior to tin deposition and post-fabrication exposure to r.f. plasma. the data indicate that sputter-etching of the silicon is required to properly prepare the surface for device..
fabrication of surface treated y-tzp thick films with al/sub 2/o/sub 3/ layers by slip casting
a fabrication process of multilayer thick films was discussed the film, consists of a three-layered structure, was stacked with protective layers of al/sub 2/o/sub 3/ against vapor attack on both sides of y-tzp layer. slip casting method was used to form a multi-layer green body. the thickness of each layer in the green body was controlle..
1000-fiber water-blocking cable
high-count cable using optical fiber ribbon is useful for reducing the construction time of optical fiber cable networks. in addition, if the cable is maintenance-free, the network maintenance cost can be reduced. therefore, the authors developed a high-count, maintenance-free cable. first, they studied high-density cable packaging using ..
effect of surface treatment on interlaminar shear strength of cfrp
carbon fiber reinforced plastics (cfrp) are expected to be used in many applications, because they have outstanding mechanical properties. however, the fracture behavior of cfrp has a special feature such as an interlaminar shear. the effects of heat treatment and sizing on interlaminar shear strength (ilss) was investigated ilss was impr..
edge junction squids and multilayers using high t/sub c/ superconductors
multilayer edge junction squids have been fabricated using epitaxial laser-ablated films of ybacuo for both electrodes. the barrier region is defined by a low voltage plasma oxyfluoridation step. the squids are patterned using photolithography and ion milling and devices have been made with linewidths as small as 2 mu m. the edge junction..