stable nanometer-scale patterns produced by high electric fields

nanometer-scale features are being produced in air on metallic surfaces using a scanning tunneling microscope developed for microscopy, spectroscopy, and fabrication. the instrument has sufficient stability, computer control, and in-process measurement capability to record important processing signals while creating nanoscale patterns. na..

mechanical thinning of compound semiconductor wafers by grinding

a back-grinding process for thinning compound semiconductor wafers has been successfully introduced. this new process drastically improves processing throughput and facilitates high-volume fabrication of wafers. the phenomena observed in the back-grinding process for compound semiconductor wafers show considerable differences from those o..

optimization of the inp/sio/sub 2/ interface treatment by (nh/sub 4/)/sub 2/s/sub x/ for the inp misfet fabrication technology

the inp surface sulfidation by (nh/sub 4/)/sub 2/s or (nh/sub 4/)/sub 2/s/sub x/ solutions is investigated in order to reduce the long-term drain-current-drift of misfet devices and the interface state density at the inp/sio/sub 2/ interface. in order to ensure good reproducibility of this treatment, a full chemical characterization of th..

effect of fuming nitric acid surface treatment of ultra-high modulus polyethylene fibers on the mechanical properties of their composites

the effect of hot fuming nitric acid (fna) treatment on the adhesion of ultra-high modulus polyethylene fabrics to an epoxy resin has been investigated. mechanical and molecular characterization of the interface has been attempted. fourier transform infrared diffuse transmittance spectroscopy has been used to monitor the chemical changes ..

effect of surface treatment of pitch-based carbon fiber on mechanical properties of polyethernitrile composites

the effect of surface treatment of pitch-based carbon fiber on a new engineering thermoplastic resin, polyethernitrile, was investigated. pitch-based carbon fiber (cf) was treated in two separate oxidizing solutions. in the first method, a nitric acid solution was used as an oxidizing agent. in the second method, a hydrogen peroxide solut..

nf/sub 3/ plasma treatment of polymeric dielectrics

polyimide and polyphenylquinoxaline are important dielectric materials used in microelectronics fabrication. these polymers could be used even more extensively if they had greater moisture resistance. the authors demonstrate that plasma processing techniques can be used to improve the moisture resistance of polyimide and polyphenylquinoxa..

using electrical failure analysis and microvolume sims to identify and quantify undesired ic dopants

if a gaas wafer surface is treated with a contaminated chemical that leaves a trace residue even after repeated rinsings and the wafer is subsequently annealed to activate an ion implant, the contaminant may diffuse into the wafer and become a dopant, consequently affecting device performance. this article discusses such a problem and the..

plasma surface treatments of carbon fibers. 2. interfacial adhesion with poly(phenylene sulfide)

for pt.1 see ibid., vol.45, no.1, p.1-7 (1992). type i and type ii carbon fibers were covered with a thin plasma polymer film and etched by an oxygen or an argon plasma to reinforce the interfacial adhesion with poly(phenylene sulfide). plasma etching of the fibers increased the interfacial shear strength up to 2.5 times which is much bet..

plasma surface treatment on carbon fibers. 1. morphology and surface analysis of plasma etched fibers

high modulus (m40) and high strength (t300) carbon fibers have been surface treated by argon and oxygen plasma to modify the fibre surfaces. the etching process and the effects of plasma gases on the carbon fibers are discussed. esca studies of treated fiber surfaces show abnormal functionality changes during the plasma treatments. a clea..

perforation impact behavior of cfrp laminates

perforation impact behavior of carbon fiber reinforced plastics (cfrp) laminates was studied by comparing it with those of glass fiber reinforced plastics, aramid fiber reinforced plastics and 7075-t6 aluminum alloy. using 'torayca' carbon fibers, m40, t300, t700s, t800h and t1000 and two types of epoxy resins having different cure temper..