fiber-matrix adhesion and its effect on composite mechanical properties. iv. mode i and mode ii fracture toughness of graphite/epoxy composites

to optimize the level of fiber-matrix adhesion an understanding of the relationship between fiber-matrix interfacial bond strength and the mechanical and fracture behavior of composites is essential. the study establishes the relationship between fiber-matrix interfacial shear strength (iss) and interlaminar fracture toughness (both mode ..

improvement of tribological characteristics of polymeric fibrous composites by electrostatic treatment of components

investigation was conducted on how the charged state in particulate thermoplastic binder used in prepreg production influences the tribological characteristics of polymer fiber-reinforced composites (pfc) based on polycarbonate and ptfce-3. the electrostatic treatment of charged particles of binder and fiber filler realized by ion-electro..

polypyrrole nanoplating on hopg utilizing an stm tip (biosensor fabrication)

the authors describe the plating of polypyrrole utilizing stm tips as the plating probe. pyrrole is oxidized in electrolyte solution to form a polymer that can switch between conducting and insulating states. the combination of small effective tip surface area, small tunneling gap and a short applied-pulse duration results in nanoscale si..

effect of biochemical treatment on the strength and adhesive properties of poly(p-amidobenzimidazole) fibers

thermostable thermoplasts reinforced with aramid fibers are promising construction materials with high impact and alternating load strength, abrasion resistance, and low thermal conductivity the low shear and compressive strength caused by both poor adhesion of the binder to the filler and poor wetting of the fibers by the thermoplastic m..

dry-etching processes for high-temperature superconductors

patterning of thin films and multilevel structures of high-temperature superconductors is a key technology for microelectronic applications. the authors performed a comparative study of ion beam etching (ibe) and reactive ion etching (rie) processes for yba/sub 2/cu/sub 3/o/sub 7- delta / thin films. the rie process with a pure chlorine p..

surface modification of spectra-900 polyethylene fibers using rf-plasma

rf-plasma polymerization and bonding of allylamine onto ultrahigh molecular weight polyethylene (uhmwpe) 'spectra-900' is described using an inductively coupled plasma reactor. this process was found to enhance the interfacial strength between the fibers (spectra-900) and room-temperature-cured epoxy matrix up to fivefold. fibers covalent..

growth of a beta -sic film on a si substrate by a direct carbonization method

single crystal beta -sic films have been fabricated on (100)si substrates through a thermal reaction between the substrate and carbon atoms sublimed from a high purity graphite source. the substrate temperature during the deposition ranged from 600 to 1100 degrees c. the film properties were analyzed by rheed and x-ray diffraction measure..

measurements of conductivity and ph of liquid using surface acoustic wave devices

the use of a shear horizontal surface acoustic wave device in measurements of conductivity and ph of liquid is described. the device has two parallel saw delay lines fabricated on 36 degrees rot y cut x-prop. litao/sub 3/. the propagation surface of the one delay line is metallized but that of the other has no metallized area for an acous..

comparison of colloidal gold electrode fabrication methods' the preparation of a horseradish peroxidase enzyme electrode

in order to prepare biosensing electrodes which respond to hydrogen peroxide, horseradish peroxidase has been adsorbed to colloidal gold sols and electrodes prepared by deposition of these enzyme-gold sols onto glassy carbon using three methods' evaporation, electrodeposition and electrolyte deposition satisfactory electrodes which gave a..

residual film detection using uv reflectance difference measurements

detection and removal of residual films is important throughout the semiconductor integrated circuit fabrication process however, at two steps in the production process, silicide formation and selective tungsten growth, removal of residual films is critical. failure to remove residuals prior to processing at these two steps will, at best,..