wafer cleaning update

a primary concern in the fabrication of vlsi devices is the levels of contamination the wafers are exposed to and removal of such contamination from the surface of the wafers before being further processed. a variety of wafer cleaning techniques are used for removing various different types of contamination from wafer surfaces. each of th..

optimization of reversible optical data storage disks

high-bit-density optical data storage disks based on reversible crystalline-to-amorphous phase transitions are discussed some of the factors controlling the performance of such disks are the signal-to-noise ratios, error rate, and stability, each of which imposes stringent requirements on the active material, geometry, and write/erase/rea..

note on the design of simple indium o-ring seals

various different applications of indium o-ring seals are briefly reviewed. a critical factor in the construction of any indium pressure-type seal is the finish of the surface cold welding to the indium. the authors present the results of some tests on surface finishes achieved by machining and grinding, which indicate certain conditions ..

future applications in laser processing

medium power ((500 w) solid state and medium and high power (up to 15 kw) co/sub 2/ lasers will have increasing application in the fabrication industry because they offer rapid, precise, clean, efficient processing of materials and, in many instances, give improved flexibility in design. this chapter indicates the major current and future..

laser welding, cutting and surface treatment

this book sets out to show how lasers are employed in a primarily productive role as opposed to their uses in metrology or quality assurance. applications range from components used in the manufacture of cardboard boxes to advanced fabrication techniques for modern jet engines, and from the encapsulation of programmable heart pacemaker de..

target fabrication for inertial confinement fusion research

the design of both laser fusion and particle beam fusion targets has become increasingly more complex with greater demands on both target tolerances and the physical and mechanical properties of target materials. the materials technology group at los alamos has been given the responsibility for fabricating these targets. in order to meet ..

parametric disturbances in the dc motors of machine-tool feed dries

one of the most important tasks in machine-tool fabrication is the development of high-speed feed electric drives with a wide range of regulation (d4>10000). as the regulation range expands, however, there is a substantial increase in the nonuniformity of electric-drive rotation at low speeds, which affects the surface finish of parts bei..

an integrated sos/fet multi-biosensor and its application to medical use

a monolithically integrated multibiosensor has been realized using sos/fet (silicon-on-sapphire/field-effect transistor) technology, which makes it possible to measure a very small sample the multibiosensor detects urea, glucose and potassium ions at the same time by using an sos/isfet (silicon-on-sapphire/ion-sensitive field-effect trans..

monolithic multi-function enfet biosensors

monolithically integrated enzyme fets (enfets) for urea and glucose detections have been successfully realized using an sos wafer and a selective enzyme immobilization technique. isfets were fabricated on a sos substrate, and urease and glucose oxidase were immobilized on the silicon nitride gate insulator using photosensitive pva films. ..

electrical and thermal stability of augeni ohmic contacts to gaas fabricated with in situ rf sputter cleaning

in situ rf sputter cleaning of the gaas surface before the augeni deposition gave low contact resistance r /sub c/=0.1 omega-mm. when the contacts were annealed at 400 degreesc for 57 hours, r/sub c/ 0.6 omega-mm was obtained. this is still an acceptable value or 1 mum gate mesfet process. with low sputtering voltages or short sputtering ..