simultaneous formation of shallow-deep stepped source/drain for sub-micron cmos

it is shown that shallow/deep source-drain regions can be formed simultaneously through the use of a disposable nitride space to create an implant screen-oxide step. both n-channel and p-channel sub-half-micron mosfets have been fabricated with excellent characteristics. significantly improved silicide contact resistance and source-drain ..

schottky and fet fabrication on inp and gainas

schottky contact with barrier heights of 0.76 ev on n-type inp and 0.65 ev on n-type gainas are realized by a new surface treatment. these contacts are used as a gate for the fabrication of field effect transistors in these materials. a transconductance of 100 ms/mm has been obtained on a device realized on gainas

choosing the proper abrasive

abrasive products are used at almost every stage in the pcb manufacturing process for cleaning and surface preparation. they clean the drums in copper foil fabrication and the caul plates after lamination. they deburr the laminated board after drilling, scrub the board after hole plating, and clean the board after etching abrasive product..

keys to fine line fabrication. i. surface preparation

the discussion addresses print and etch 4 mil line/5 mil space circuits: three major steps in the process are surface preparation, imaging and etching. each of these steps has a significant effect on the success of the overall process. in optimizing a part of the process, the effect on the end result must be included in the measurement cr..

developing a cleaner-conditioner for electroless copper

with the most common type of fr4 copper clad laminate, the drilled hole wall consists of epoxy and fiberglass reinforcements, as the dielectric material, between two copper clad foils. these glass fiber bundles are recognized as the more difficult region to obtain copper coverage and adhesion. this work keyed on the development of an impr..

analytical techniques to monitor and control printed circuit plating

plating and surface finishing operations play a central role in multilayer printed circuit board fabrication. conductors, terminations, interconnections, ground planes, and heat dissipators are examples of multilayer board components that can be fabricated in place by electroplating operations. the basic plating and surface finishing oper..

treatment of polymer surfaces by low pressure microwave plasmas

improved wettability and adhesion are obtained for polypropylene after brief exposure to a low pressure microwave cold nitrogen plasma which optionally may contain fluorine compounds this process is used to create adhesion of epoxy resins on polypropylene surfaces for the fabrication of electronic components it has to take the place of a ..

ab initio study of fluorinated silylboranes. ii

the reactions of singlet silylenes, h/sub 2/si and f/sub 2/si, with fluoroborane, fbh/sub 2/, have been studied by ab initio molecular orbital methods using 3-21g and 6-31g*(5d) basis sets. the effects of electron correlation at selected geometries were determined by moller-plesset perturbation theory. the reactions of h/sub 2/si with fbh..

polarization-desensitized liquid-crystal overlay optical-fiber modulator

a fiber-based device with a novel nematic liquid-crystal overlay compatible with silica fiber at room temperature is reported here to demonstrate polarization-independent modulation. the device is formed using a polished half-coupler block that has been surface treated so that the liquid crystal affects orthogonal polarizations in a simil..

integrated fabrication of polysilicon mechanisms

the integrated fabrication of planar polysilicon mechanisms incorporating lower and higher kinematic pairs (or joints) is described. the two lower kinematic pairs (revolute and prismatic) commonly used in macrorobotic systems are compatible with silicon microfabrication technology. the mechanisms are fabricated by surface micromachining t..