improved pattern fabrication of naphthoquinonediazide-based deep ultraviolet resist by alkaline surface treatment

this paper presents the high-aspect-ratio pattern fabrication method for krf excimer laser lithography. the alkaline surface treatment of a resist before exposure can enhance the contrast of a conventional naphthoquinone-diazide-based deep uv positive resist it has been found that the improvement depends upon the structure of the resist. ..

marked reduction of the surface/interface states of gaas by (nh/sub 4/)/sub 2/s/sub x/ treatment

mis capacitors have been fabricated on (nh/sub 4/)/sub 2/s/sub x/-treated gaas using a sio/sub x/ insulator prepared by conventional resistive-heating evaporation. the mis interface state density was found to be about 1.2*10/sup 11/ cm/sup -2/.ev/sup -1/ in a wide range of the band gap, which is two orders of magnitude less than that on t..

application of aluminium-alloy ultrahigh vacuum system to semiconductor device fabrication processes

the aluminium-alloy ultra-high-vacuum (uhv) system has been shown to possess several excellent vacuum properties, such as an extremely low outgassing rate and an extremely short pumpdown time to reach the uhv region. it has, therefore, a considerable potential as a uhv system for next-generation semiconductor processes. for this applicati..

degradation of fiber strength during coating stripping

the use of fiber optic cables in telecommunications has broadened quickly from long distance transmission to include subscriber loops and customer premises installations. the preparation of either mechanical or fusion splices or the installation of connectors normally includes several steps which may damage the fiber, including removal of..

flame-resistant optical fiber cable with corrosion-protective painted stainless steel sheath

a flame-resistant optical fiber with a stainless steel sheath is proposed. as a result of the flame test (ieee 383 standard) on a 12-fiber optical fiber cable based on the proposal, it was found that only the corrosion-protective paint on the stainless steel surface, which was exposed to the flame, was burned (burn length 30 to 45 cm). du..

nanometer x-y positioning stages for scanning and stepping

this paper describes new developments in x-y stages for scanning or stepping and use in vacuum. the requirement for high dynamic stiffness is analyzed as to its effects on positioning accuracy in dynamically moving stages (scanning) and on settling time for stepping applications. novel solutions are described to increase the accuracy and ..

use of two-dimensional protein crystals from bacteria for nonbiological applications

this paper gives an overview on the structure, chemistry, self-assembly, and technical application potentials of crystalline bacterial cell surface layers (s layers). these structures represent ideal model systems for studying self-assembly processes on the nanometer level. since s layers reveal no pore size distribution they can be used ..

fabrication and test of x-ray optics

a review on state of the art fabrication and test methods for grazing incidence x-ray optics is given with the main emphasis on optics used in synchrotron radiation beam lines. key topics discussed are' substrate materials, dimensions, properties, and surface characteristics: steps in manufacturing and polishing of aspherical elements: sp..

review of corrosion and corrosion control of magnesium alloys and composites

some physical properties of magnesium are reviewed. a discussion of the corrosion mechanisms at work on magnesium under various environmental conditions follows. the role of base metal impurities is investigated. the strengths and limitations of the more traditional corrosion protection methods are discussed. several modern non-paint surf..

the role of atmospheric oxygen and water in the generation of water marks on the silicon surface in cleaning processes

water marks are one of the most common contamination problems, which induce various kinds of device defects in (lsi) technology water marks have been attributed to residues of water used in the cleaning process. however, the purity of deionized water used in lsi fabrication today is extremely high. nevertheless, the authors recently found..