reduction of process-induced defects in power devices

the impact of various technology steps during the fabrication process on the generation of detrimental defects in power devices has been investigated to find a way of reducing these defects in the critical device regions. the experiments demonstrate that both the recombination rates as well as the generation rates of charge carriers chang..

high temperature schottky diodes with boron-doped homoepitaxial diamond base

the authors report the first high temperature operation of thin film diamond based semiconductor devices. boron-doped homoepitaxial diamond films were grown by microwave plasma assisted chemical vapor deposition using insulating natural diamond substrates. the diamond nature of the films was confirmed by several analytical techniques. exc..

nato asi workshop on in-situ processing

the following topics were dealt with' surface cleaning: film growth: lithography and micromechanic fabrication: monitoring techniques: cluster-tool engineering

surface passivation of backside-illuminated indium antimonide focal plane array

a novel surface passivation tailored to a two-dimensional array of small-area, gate-controlled insb photovoltaic diodes fabricated on etch-thinned bulk insb wafers, with backside illumination, is presented. the surface passivation is based on a controlled surface treatment that reduces the native oxide and is followed by photon-assisted d..

the selective epitaxial growth of silicon

the techniques of selective silicon growth (ssg) have already found many applications in device fabrication in respect of both process simplification and the development of novel device structures: the techniques involve selective epitaxial growth (seg), epitaxial lateral overgrowth (elo), selective polycrystalline si growth (spd) and sel..

nano-fabrication on silicon at high temperature in a uhv-stm

the microscopic manipulation of atoms at high temperature has been attempted. a uhv-stm is designed to facilitate sample heating up to 1300 degrees c after sample introduction. the uhv-stm employs stacked piezoelectric elements to control the three-dimensional drive of the tip. nano-fabrication utilizes this fine positioning mechanism and..

interlaminar fracture toughness of aramid/epoxy laminates

the mode i interlaminar fracture toughness of woven aramid-fibre/epoxy laminates has been investigated as a function of the fibre surface properties. values of g/sub ic/ were found to increase significantly with increasing crack length as a consequence of the presence of fibre bridging in the wake of the propagating crack. the plateau val..

mechanical properties of glass fiber/talc/polybutylene-terephthalate composites as processed by the radlite technique

in this investigation, the effect of glass fiber and talc loading on the mechanical and physical properties of chopped glass fiber reinforced polybutylene terephthalate composites has been studied. further areas of investigation include the effect of fiber length, talc particle size and talc surface treatment. the so-called radlite proces..

emi shielding efficiency of metal coated fiber-containing conductive polymeric composite sheets

to prevent or reduce electromagnetic interference, conductive polymer composite sheets were formed and evaluated for their potential shielding effectiveness. these types of sheets are composed of metal coated fibers and synthetic resins such as poly(vinyl-chloride), acrylic and polyurethane resins. metallized polyester and glass fibers we..

fabrication and characterization of proton-exchanged optical waveguides in z-linbo/sub 3/ using orthophosphoric acid

a systematic study of the fabrication and characterization of planar optical waveguides in z-linbo/sub 3/, fabricated by the proton exchange technique using orthophosphoric acid is reported the guides are fabricated by immersing lithium niobate substrates in orthophosphoric acid for different durations. the results are compared with those..