섬유

surface mount international conference and exposition proceedings of the technical program

  • 출판일1999.03
  • 저자
  • 서지사항
  • 등록일 2016.11.02
  • 조회수 442
the following topics were dealt with' mcm materials and packaging technology: chip-on-board: advanced interconnection: packaging ics for multichip modules: smt assembly issues: smt-tab assembly: advanced smt assembly: computer integrated manufacturing: test tissues: inspection and process control: reliability: quality: pcb coatings and protection: advanced pcb fabrication processes: pcb processes and materials: new developments in soldering materials and processes: environmental issues: controlled atmosphere soldering: cleaning alternatives: surface mount components: design for manufacturability: advanced rework and repair: electronic manufacturing process improvement: smt in military applications: and impact of new standards on smt
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