addresses the effect of surface mount requirements as they are related to the manufacture of bare printed wiring boards. the issues to be discussed include' availability and characteristics of different available surface finishes. this includes hot-air solder leveling, immersion tin-lead and reflow, nickel/gold, flux lacquer and bare copper with anti-tarnish. horizontal versus vertical hot-air leveling. effect of pad size and configuration on hot air leveling. pure surface mount board versus mixed technology product and its effect on hot-air leveling's ability to maintain sufficient solder thickness. the characteristics of different types of photoimageable soldermask and how to select the proper type for different applications. this will include aqueous versus solvent developable masks, thickness, hardness and image definition testability of very fine pitch surface mount (less than .025'' pitch) and double-sided surface mount boards. how to guarantee product is receiving a true 100 percent electrical test and ways to design a more testable product