섬유

preparation and characterization of aln substrates for metal and dielectric film deposition

  • 출판일1999.03
  • 저자
  • 서지사항
  • 등록일 2016.11.02
  • 조회수 411
reports on material characterization and processing steps required for the successful deposition of metallic and low dielectric constant films of high adhesion strength on high thermal conductivity aluminium nitride substrates for use in multichip microelectronic fabrication
이전글 다음글 목록