섬유

proceedings of the third international symposium on ultra large scale integration science and technology. ulsi science and technology 1991

  • 출판일1999.03
  • 저자
  • 서지사항
  • 등록일 2016.11.02
  • 조회수 412
the following topics were dealt with' device structure and technology: submicron device and process modelling: lithographic submicron feature patterning: submicron feature patterning using etching: shallow junctions and ohmic contacts: thin gates process-induced damage and contamination: rapid thermal processing: planarisation techniques: interconnect and packaging: wafer cleaning and oxidation: and thin film deposition
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