섬유

application of dielectric isolation technology based on soot bonding

  • 출판일1999.03
  • 저자
  • 서지사항
  • 등록일 2016.11.02
  • 조회수 406
a soot bonding method has been developed that solves the economic and limited-diameter problems associated with the conventional dielectrically isolated substrate. in this method, the si-b-o soot particles used as adhesive agents are generated by essentially the same flame-hydrolysis technology used for fabricating optical waveguides. this soot bonding method is effective even for joining a surface with deep v-grooves or trenches, as well as for rough poly-si-deposited surfaces. the ability to bond substrates with any joining surface conditions is expected to lead to wide application of this process and to a reduction of the steps, resulting in cost reduction
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