섬유

surface mount international, conference and exposition proceedings of the technical program

  • 출판일1999.03
  • 저자
  • 서지사항
  • 등록일 2016.11.02
  • 조회수 443
the following topics were dealt with' tape automated bonding: multichip modules: hi-density packaging: low volume manufacturing: soldering materials and processes: fine pitch technology: innovative assembly methods, manufacturing equipment: environmental alternative studies: cleanliness measurements in evaluating alternatives: fluxes and cleaning alternatives: solder paste technology and applications: pcb hi-density board processing: substrate materials: spc/doe: surface mount components/government applications: reliability government smt: design, materials and assembly to meet government requirements: total quality management: pcb design: solder mask selection: design for manufacturability: design, fabrication and test of controlled impedance pcbs: components: inspection: total quality control of surface mount circuit: reliability concerns: and test strategy for surface mount
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