섬유

surface hydrophilization during direct silicon bonding

  • 출판일1999.03
  • 저자
  • 서지사항
  • 등록일 2016.11.02
  • 조회수 398
ammonia hydrophilization prior to direct silicon-wafer bonding substantially reduces the deep-center density in the fabricated structures, increases the breakdown voltage of the junctions, and is more promising for the fabricated of high-power devices by the dsb method than is hydrophilization with h/sub 2/so/sub 4/
이전글 다음글 목록