섬유

special hybrid package for laser semiconductor dice in optical telecommunications

  • 출판일1999.03
  • 저자
  • 서지사항
  • 등록일 2016.11.02
  • 조회수 355
describes a special hybrid package which complies with the following specifications' the two laser emissive areas free for coupling two optical fibers: this package must have a very low thermal resistance: this package must be compatible with laser dice of any size: and for die bonding and wiring, this package must be locally plated with a very thin bonding solder, and a metallized alumina substrate must be provided for the wiring. the authors list the package requirements and describe the package structure and fabrication (copper sheet, with an optical polish side for the laser die soldering, brazed in a grooved copper base): and surface finishing (nickel-gold plating). they describe the methods used for in solder plating and for the die soldering and wiring. this laser hybrid package makes easier transmitter fabrication, and allows some studies in optical transmission with monomode fibers
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