섬유

surface pre-treatment process for tantalum contacts

  • 출판일1999.03
  • 저자
  • 서지사항
  • 등록일 2016.11.02
  • 조회수 351
describes a method by which the desirable properties of sputtered ta can be combined with those of evaporated ta with minimum manufacturing tool impact. a surface pre-treatment is done with 20-50 aa of sputtered ta immediately prior to the standard evaporations. this very thin sputtered ta layer does not cause 'fences', and does not lead to resist flow because of the short duration of the deposition cycle. it is deposited through the standard lift-off mask already in place, and fabrication of the wafers proceeds in a conventional way. the ta may be implanted rather than sputtered
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