a selected process sequence for the low cost fabrication of photovoltaic modules was defined during this contract. each part of the process sequence was looked at regarding its contribution to the overall dollars per watt cost. during the course of the research done, some of the initially included processes were dropped due to technological deficiencies. the printed dielectric diffusion mask, codiffusion of the n+ and p+ regions, wraparound front contacts and retention of the diffusion oxide for use as an ar coating were all the processes that were removed for this reason. other process steps were retained to achieve the desired overall cost and efficiency square wafers, a polymeric spin-on px-10 diffusion source, a p+ back surface field and silver front contacts are all processes that have been recommended for use in this program. the printed silver solderable pad for making contact to the aluminum back was replaced by an ultrasonically applied tin-zinc pad. also, the texturized front surface was dropped as inappropriate for the sheet silicon likely to be available in 1986. progress has also been made on the process sequence for module fabrication. a shift from bonding with a conformal coating to laminating with ethylene vinyl acetate and a glass superstrate is recommended for further module fabrication. the finalized process sequence is described. (era citation 06:004641)