섬유

investigation of proposed process sequence for the array automated assembly task, phase 2. / low cost silicon solar array fabrication

  • 출판일1999.03
  • 저자
  • 서지사항
  • 등록일 2016.11.02
  • 조회수 311
the technological readiness of the proposed process sequence was reviewed. process steps evaluated include: (1) plasma etching to establish a standard surface; (2) forming junctions by diffusion from an n-type polymeric spray-on source; (3) forming a p+ back contact by firing a screen printed aluminum paste; (4) forming screen printed front contacts after cleaning the back aluminum and removing the diffusion oxide; (5) cleaning the junction by a laser scribe operation; (6) forming an antireflection coating by baking a polymeric spray-on film; (7) ultrasonically tin padding the cells; and (8) assembling cell strings into solar circuits using ethylene vinyl acetate as an encapsulant and laminating medium
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