data were gathered and analysis continued on thirteen process task groups. four tasks were completed. a solar cell test data acquisition system was constructed, which showed that an automated system for collecting data on solar cell electrical performance is very useful and suitable for large-scale production. the application of plasma etching to thick film resist removal was studied and was not found to be a promising process technique. the laser trimming and holing operation was completed. wafer surface preparation experiments were completed and a samics study performed. the new texturizing system would add 6.39 cents to the price of a cell. a preliminary investigation led to the selection of the laser scanning method for the detection of mechanical defects in silicon solar cells. the present technology in thick film printing has been reviewed and some of the anticipated problem areas have been investigated. the current technology in the field of plasma silicon nitride deposition was studied and a preliminary cost estimate was performed. a new moderately sized system for the sequential plating of silicon wafers has been designed and found to be conducive for automation requirements. technical information pertaining to the spray on dopant and drying system was obtained. the solar cell interconnection method which uses a copper clad kapton sheet without overlay was designed. a preliminary flexible printed circuit sheet for the 2' x 4' module was drawn and the fabrication of a design feasibility model which would demonstrate the viability of the flexible printed circuit shee