섬유

method for anisotropically etching a silicon wafer having a reinforced peripheral portion

  • 출판일1999.03
  • 저자
  • 서지사항
  • 등록일 2016.11.02
  • 조회수 314
a method is described for producing silicon wafers having reinforced peripheral portions for use in the production of silicon solar cells the method is characterized by the steps of applying to the surface of the central portion of one surface of the silicon wafer to be etched, a mask leaving an exposed peripheral portion of the surface, depositing a layer of metallization on the exposed peripheral portion of the surface, removing the mask from a central portion of the surface and treating the thus exposed surface with an etching fluid for etching the central portion of the wafer to a desired thickness, and thereafter removing the layer of metallization from the surface of the peripheral portion of the cell
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