a memory module consists of a wired array of ferrite cores bonded and soldered to a hybrid microcircuit (hmc). the hmc is shipped to the memory plane supplier, where it is attached to the memory plane and returned. by developing suitable manufacturing processes, the need to ship the hmc to the memory supplier can be eliminated and material control problems can be simplified. a process is described that will allow bendix to do all memory assembly work except stringing the core array: (1) a controlled process that relies more on programmed soldering machine instructions and less on operator variables was developed to produce repeatable solder joints. a key to this process was producing well-tinned magnet wires prior to making the solder joint; (2) a process was developed to bond memory planes to hmcs with an epoxy sheet adhesive; (3) a thin polyurethane coating can be selectively applied to solder joints with a very fine 5/0 artist's brush. the work must be done under a microscope; and (4) a method of testing the memory plane on existing equipment and a cause-of-failure test matrix for the completed module were developed restringing defective memory planes at bendix is feasible, but additional development will be required. the reliability of machine soldered joints should be determined by subjecting properly soldered memory modules to an extensive thermal cycling evaluation. (era citation 02:005584)