elastomeric syntactic foams have been developed for use as stress relief coatings on electronic components in encapsulated electronic assemblies. polysulfide, silicone, and polyurethane elastomers blended with microbubbles made from glass and phenolic resins have all been used to formulate syntactic foams for various applications these foams are used to minimize the stresses caused by differential thermal expansion between the component and the encapsulant in electronic assemblies. compressive stress strain curves have been used to determine the effects of temperature, formulation, and test configuration on these foams. the microbubble-resin blends are fluid enough to evacuate and pour before curing. these foams may be applied using a low-pressure injection molding technique or by simply brushing or dipping. testing techniques, necessary to evaluate these sheets of elastomeric syntactic foams, were developed. these elastomeric syntactic foams have proven to be easily formulated, versatile materials that have been used in many applications to relieve the stresses caused by differential thermal expansion. (era citation 03:001173)