섬유

stress relief printed circuit wiring

  • 출판일1999.03
  • 저자
  • 서지사항
  • 등록일 2016.11.02
  • 조회수 354
a technique is described for providing stress relief in printed wiring patterns on printed circuit cards for compensating for variances in thermal expansion and contraction between components and the card. in the past stress has been concentrated in the solder connection. on compliant surface cards stress has been transferred to the printed circuit wiring. adding a jog in the wiring pattern coming from the surface-soldered component relieves stress on the wiring
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