섬유

mechanism of photoresist resolution improvement by pre-exposure treatment

  • 출판일1999.03
  • 저자
  • 서지사항
  • 등록일 2016.11.02
  • 조회수 297
in the lithography for fabrication of ultra-large scale integrated circuits (ulsi), positive photoresists are used in combination with stepper. one of the methods for improving pattern profile of a positive photoresist is pre-exposure treatment. this paper discusses an insoluble layer which forms on the photoresist surface by pre-exposure treatment. from an analytical result of used developer for pre-exposure treatment, we have found that tbp-nqd triester (triester of trihydroxybenzophenone with naphthoquinone-1, 2-diazide-5-sulfonic acid) and high molecular weight portion of novolak resin in the positive photoresist were insoluble in the developer. we presume that those components are forming insoluble layer on the photoresist surface. (edited author abstract) 3 refs
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