섬유

'state of the art' microcircuit interconnect fabricated by copper plating on ceramic

  • 출판일1999.03
  • 저자
  • 서지사항
  • 등록일 2016.11.02
  • 조회수 336
the rapid growth of very large scale integration (vlsi) results in increasing demands on circuit fabrication techniques to address high pin count devices. this paper describes an innovative semi-additive process whereby high resolution copper circuitry is plated onto alumina ceramic to form interconnection with significant cost, performance and reliability benefits. the resulting circuit plated substrates are capable of 50 micron features with conductor lines of near perfect rectangular cross sectional shape. an innovative aspect of the method is that all the metallisation steps are achieved using metal containing solutions and results in a strong chemical bond of the circuitry to the alumina ceramic without th eneed for disruptive surface treatments. the as-manufactured properties of industry standard alumina substrates are therefore retained which also facilitates the incorporation of air-firming ruthenium based resistors. (edited author abstract) 1 ref
이전글 다음글 목록