섬유

stock bonding problem: a macro investigation of micro flaws in mil-spec boards

  • 출판일1999.03
  • 저자
  • 서지사항
  • 등록일 2016.11.02
  • 조회수 299
current manufacturing technology used to fabricate polyimide pcbs has evolved from processes used to make epoxy boards. these processes have been found to give variable bond quality between innerlayer traces/planes and the polyimide b-stage material. results of studying standard oxiding and several novel surface treatments demonstrated that several areas dramatically affected the quality of the copper/polyimide bond. these include strict materials control prior to laminating, incorporating an aggressive chemical copper etching, use of a minimum thickness copper oxide film to promote adhesion, and a laminating press cycle optimized for polyimide. the overall results indicate that this copper/polyimide bond could be improved to the point of structural failure rather than interfacial failure. this may be accomplished within the existing materials and technology or with new surface treatments. 3 refs
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