섬유

aesf third international pulse plating symposium

  • 출판일1999.03
  • 저자
  • 서지사항
  • 등록일 2016.11.02
  • 조회수 283
this conference proceedings on 'pulse plating' contains 17 papers. the topics covered are: pulse plating vs. dc plating; high speed metal deposition using interrupted current plating techniques; orientation and morphology of pulse plated deposits; pulsed current electrodeposition of palladium and alloys, gold and alloys, nickel and alloys including compositions, control and morphology of these deposits; deposition of artificially layered materials and composite coatings on carbon fibers; deposition of nickel from water-amide baths; practical aspects of pulse plating; terminology and sizing of pulse plating rectifiers; hard chrome plating and anodizing with pulsed current. technical and professional papers from this conference are indexed and abstracted with the conference code no 09892 in the ei engineering meetings (tm) database produced by engineering information, inc
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