this conference proceedings contains 17 papers. topics covered are: approaches to surface mount technology; advanced control for plating lines; precious metals in electronics; x-ray calibration standards; hydrogen peroxide-sulfuric acid etching for pc boards; job-shop management; electroplated palladium-silver alloys; measuring interface resistance in tab bumped wafer fabrication; palladium recovery from wash water; nickel-indium alloys for electronic applications; electroless copper process characterization; remote-sensing analyzer for gold plating solutions; statistical process control for electronics electroplating; lead contamination removal in acid hard gold plating baths; acid copper plating for pcb applications; and screen printing for pcb applications. technical and professional papers from this conference are indexed and abstracted with the conference code no. 10094 in the ei engineering meetings (tm) database produced by engineering information, inc