섬유

factors influencing the quality of solder powder used in solder pastes for thick film circuits, printed circuitboards and the electronics industry in general

  • 출판일1999.03
  • 저자
  • 서지사항
  • 등록일 2016.11.02
  • 조회수 278
the purpose of this report is to present an analysis of factors affecting the quality of solder powder used in solder paste systems these systems, used in hybrid microelectronics, are applied to complex thick film cirucits using 'silk' screen techniques common to the industry. the report deals with actual results and recommendations concerning the solder powder in terms of rheology, solderability and minimization of solder ball generation (maximization of metal retention). 15 refs
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