섬유

integration of a $left double quote$ thin $right double quote$ and a $left double quote$ thick $right double quote$ film resistor system on 96 alumina results in an optimized combination of two complementary technologies

  • 출판일1999.03
  • 저자
  • 서지사항
  • 등록일 2016.11.02
  • 조회수 268
a conventional silk screen printing process is used to deposit on a same alumina substrate $left double quote$ thin $right double quote$ (400 to 1400 a) and $left double quote$ thick $right double quote$ (100,000 to 200,000 a) resistive films. due to a 135 $degree$ c lower firing temperature of the metallo-organic paste used on the $left double quote$ thin $right double quote$ film system as compared with the ruo//2-based $left double quote$ thick $right double quote$ film process, a controllable interaction on the sheet resistivity of the thick-film is noticed. the combination of the two systems allows an optimization of the electrical characteristics of the integrated network. the metallo-organic system excels through: resistor stability in the low and medium ohmic range, low noise and high power loading capability. the thick film system can stand higher voltage stress, offers small t. c. and extends far in the ohmic resistance range
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