섬유

direct mounting of ceramic leadless chip carrier onto glass epoxy circuit board

  • 출판일1999.03
  • 저자
  • 서지사항
  • 등록일 2016.11.02
  • 조회수 225
leadless chip carrier (lcc) packages provide an excellent means of protecting/connecting the complex multileaded circuit functions of lsi, vlsi, and vhsic. however, before the use of lcc in commercial and military equipment can become cost-effective, reliable methods for mounting lcc's to standard, printed circuit boards must be developed. a technique was investigated for modifying the surface elasticity of the conventional epoxy glass pc boards for reliable mounting of lcc's to printed circuit boards as well as the theory behind the technique, the experimentation methods, the experimental test results, and the conclusions. this technique has the advantages of low cost and ready acceptability by the printed circuit board manufacturers. 6 refs
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