섬유

gehaeuse- und leiterplattentechnologie von lsi-/vlsi-schaltkreisen. $left bracket$ housing and printed-circuit technology of lsi and vlsi circuits $right bracket$

  • 출판일1999.03
  • 저자
  • 서지사항
  • 등록일 2016.11.02
  • 조회수 235
problems associated with the design of adequate housing for integrated circuits are discussed. these problems have become acute in view of the ever-growing functional density of ics. the dual-in-line (dil) housing configuration, the so-called dip, with a pin separation of 1 in. is a dominant factor. the effects on printed-circuit boards are discussed, along with p/c board substrates for vlsi housing while taking into consideration the coefficient of expansion. in german
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