섬유

auswirkung der zinn-blei-plattierung beim nachschmelzen $left bracket$ effect of tin-lead plating in the remelting process $right bracket$

  • 출판일1999.03
  • 저자
  • 서지사항
  • 등록일 2016.11.02
  • 조회수 254
problems associated with flow melting of tin-lead coatings involved in the manufacture of printed-circuit boards are considered in particular, the remelting process in conjunction with plating is discussed. the importance of careful purification and preparation prior to putting the p/c boards into a (chemical) both is pointed out. instrumentation that is appropriate for this purpose is described. in german
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