섬유

chip components can be flow-soldered on both sides of a board to boost density

  • 출판일1999.03
  • 저자
  • 서지사항
  • 등록일 2016.11.02
  • 조회수 248
for the first time, chip components can be flow-soldered on a printed-circuit board along with other components. this new generation of chip resistors, chip capacitors, chip diodes and chip transistors can be attached automaticlly to either or both sides of a p/c board. furthermore, the chips dramatically increase packaging density, significantly reduce production costs and improve product reliability
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