비의류제품

analytical techniques to monitor and control printed circuit plating

  • 출판일1999.03
  • 저자
  • 서지사항
  • 등록일 2016.11.02
  • 조회수 456
plating and surface finishing operations play a central role in multilayer printed circuit board fabrication. conductors, terminations, interconnections, ground planes, and heat dissipators are examples of multilayer board components that can be fabricated in place by electroplating operations. the basic plating and surface finishing operations related to pattern plating of copper clad epoxy-glass laminates are illustrated. these overall process steps are similar for most multilayer boards. the authors discuss various types of ion chromatography, high-pressure liquid chromatography and pulsed amperometric detection
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