although in large sectors of electrotechnics the electronics has replaced most mechanical components, there is still a substantial demand for miniature-sized micromechanical components the extremely high-quality requirements in respect of surface finish, accuracy, and stability are mostly fulfilled by x-ray lithography as applied in the semiconductor industry. the author gives a general, but informative, overview of micromechanical components, being fabricated by the liga-method, and which are marked by an extremely large height-width ratio of the component, ranging up to a ratio of 1'100. the liga-technology, its automization and in particular the fabrication of x-ray masks and the selection of metallic and ceramic forming materials are outlined. liga-components for the electronics, for instance microchannel plates, are listed and their benefits are specified. in view of the rising demand for micromechanics, produced with liga, necessitating mass production and having high aspect ratio, intended and possible future steps are sketched. of interest is a described micro-microphone, being sized 1.7*2*0.6 mm and being fabricated with liga-methods