비의류제품

wafer cleaning update

  • 출판일1999.03
  • 저자
  • 서지사항
  • 등록일 2016.11.02
  • 조회수 487
a primary concern in the fabrication of vlsi devices is the levels of contamination the wafers are exposed to and removal of such contamination from the surface of the wafers before being further processed. a variety of wafer cleaning techniques are used for removing various different types of contamination from wafer surfaces. each of the different wafer cleaning techniques has particular advantages for removing a specific type of contamination for example, wet chemical cleaning is efficient in removing alkali and metal ions that may be either physically or chemically attached to the wafer surface. the different techniques are used individually in some situations and in others they are used in conjunction with one another
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