비의류제품

smd and gate array. new integration technologies in electronics. i

  • 출판일1999.03
  • 저자
  • 서지사항
  • 등록일 2016.11.02
  • 조회수 465
progress in printed circuit board and integrated circuit miniaturisation has contributed to surface mounting of electronic components and the use of asics in custom circuits. surface mount, thick film, hybrid, thin film, asic, gate array, standard cell, full custom circuit, and programmable array logic technologies are briefly explained. the importance and principles of component surface mounting, and surface mounted device pcb manufacturing methods comprising solder paste and silk screen technique, wave soldering, and a combination of both, are described. organisational and technical considerations for introduction of pcb manufacture with surface mounted devices are presented
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