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비의류제품
an overview of solder paste application equipment, techniques
- 출판일1999.03
- 저자
- 서지사항
- 등록일 2016.11.02
- 조회수 458
solder paste dispensing can be done while 'stepping over' components already fixed in place. additionally, by using multiple-nozzle arrays, the paste can be applied on different planes at the same time, or at process points most convenient to the manufacturing process. the configuration of dot patterns deposited by multiple nozzle arrays is unlimited and the area covered can be equal to or larger than that covered by silk screening. there are few practical limitations to solder paste dispensing techniques
