SITE MAP
주요사업
- 시험분석
- 품질검사
- 제품안전·인증·검증
-
제품안전(KC)
- 연구개발
- 기업지원
기술정보
비의류제품
high-grade semi-finishes for modern electronics
- 출판일1999.03
- 저자
- 서지사항
- 등록일 2016.11.02
- 조회수 483
discusses the new copper-backed base material cu 010 for micro-electronics (epoxy resin-glass silk fabric with 17.5 mum-cu-foil backed), the 17.5 mum-cu-foil for printed circuits copper-backed base material cu 47 (self-quenching) as well as the unbacked base material of type 072 for printed circuits. the most important technical parameters are indicated for each material
