비의류제품

integration of a 'thin' and a 'thick' film resistor system on 96percent alumina results in an optimized combination of two complementary technologies

  • 출판일1999.03
  • 저자
  • 서지사항
  • 등록일 2016.11.02
  • 조회수 511
summary form only given, as follows' a conventional silk screen printing process is used to deposit on the same alumina substrate 'thin' (400 to 1400 aa) and 'thick' (100000 to 200000 aa) resistive films. due to a 135 degreesc lower firing temperature of the metallo-organic paste used on the 'thin' film system as compared with the ruo/sub 2/ based 'thick' film process, a controllable interaction on the sheet resistivity of the thick-film is noticed the combination of the two systems allows an optimization of the electrical characteristics of the integrated network. the metallo-organic system excels through resistor stability in the low and medium ohmic range, low noise and high power loading capability the thick film system can stand higher voltage stress, offers small tc and extends far in the ohmic resistance range
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